Invention Grant
US08482308B2 Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
有权
连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片
- Patent Title: Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
- Patent Title (中): 连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片
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Application No.: US12614504Application Date: 2009-11-09
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Publication No.: US08482308B2Publication Date: 2013-07-09
- Inventor: Ki-Jae Song , Hun-Kyo Seo , Jae-Il Lee , Jong-Won Han , Jong-Pil Park
- Applicant: Ki-Jae Song , Hun-Kyo Seo , Jae-Il Lee , Jong-Won Han , Jong-Pil Park
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0110594 20081107
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28
Abstract:
A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.
Public/Granted literature
- US20100117670A1 CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME Public/Granted day:2010-05-13
Information query
