Invention Grant
US08482374B2 Low-resistance carbon grounding module and method for manufacturing the same 有权
低电阻碳接地模块及其制造方法

  • Patent Title: Low-resistance carbon grounding module and method for manufacturing the same
  • Patent Title (中): 低电阻碳接地模块及其制造方法
  • Application No.: US13473315
    Application Date: 2012-05-16
  • Publication No.: US08482374B2
    Publication Date: 2013-07-09
  • Inventor: Young-Ki Chung
  • Applicant: Young-Ki Chung
  • Applicant Address: KR Seoul
  • Assignee: Omni LPS. Co. Ltd.
  • Current Assignee: Omni LPS. Co. Ltd.
  • Current Assignee Address: KR Seoul
  • Agency: Ballard Spahr LLP
  • Priority: KR10-2011-0047563 20110519
  • Main IPC: H01C7/00
  • IPC: H01C7/00
Low-resistance carbon grounding module and method for manufacturing the same
Abstract:
The present invention provides a low-resistance carbon grounding module and a method for manufacturing the same, which can increase strength for durability against external environmental changes by varying the type and mixing ratio of raw materials for a carbon resistor without using any heat source. The low-resistance carbon grounding module comprises a carbon resistor extending in the longitudinal direction thereof and a conductive core bar installed in the center of the transverse section of the carbon resistor, wherein the carbon resistor comprises graphite, cement, and feldspar. Thus, it is possible to prevent the durability from being deteriorated due to external environmental changes, water, or electrical resistance, thus improving the quality and reliability of the product while minimizing the production of CO2.
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