Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
-
Application No.: US12805889Application Date: 2010-08-23
-
Publication No.: US08482426B2Publication Date: 2013-07-09
- Inventor: Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
- Applicant: Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-277618 20050926; JP2006-159513 20060608
- Main IPC: G08B3/00
- IPC: G08B3/00

Abstract:
It is intended to provide a substrate processing apparatus capable of reliably informing a running state of the apparatus. The substrate processing apparatus having a signal indicator for indicating the running state, including a signal indicator capable of setting at least one operation condition under which the signal indicator operates as well as of operating under anyone of a plurality of operation conditions and a display unit capable of displaying that a cause of the operation is anyone of the operation conditions during the operation of the signal indicator.
Public/Granted literature
- US20110012745A1 Substrate processing apparatus Public/Granted day:2011-01-20
Information query