Invention Grant
- Patent Title: Low profile antenna assemblies
- Patent Title (中): 薄型天线组件
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Application No.: US13552320Application Date: 2012-07-18
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Publication No.: US08482466B2Publication Date: 2013-07-09
- Inventor: Cheikh T. Thiam , Andreas D. Fuchs , John V. Kowalewicz , Ralf Lindackers
- Applicant: Cheikh T. Thiam , Andreas D. Fuchs , John V. Kowalewicz , Ralf Lindackers
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas.
Public/Granted literature
- US20120280888A1 LOW PROFILE ANTENNA ASSEMBLIES Public/Granted day:2012-11-08
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