Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US13270535Application Date: 2011-10-11
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Publication No.: US08482665B2Publication Date: 2013-07-09
- Inventor: Hae Jin Jeon , Joo Young Ha , In Taek Song
- Applicant: Hae Jin Jeon , Joo Young Ha , In Taek Song
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2011-0075371 20110728
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N7/18

Abstract:
Disclosed herein is a camera module including: an image sensor which converts an image entering through a lens into an electric signal; a rigid-flexible substrate which includes first and second rigid substrates distanced from each other and a flexible substrate to connect the first and the second rigid substrates to each other; a first connection part which is electrically connected to the rigid-flexible substrate; and a second connection part which has one end electrically connected to the first connection part and the other end connected to a cable, and which is disconnectable from the first connection part and the cable.
Public/Granted literature
- US20130027607A1 CAMERA MODULE Public/Granted day:2013-01-31
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