Invention Grant
US08482890B2 PCB strip and manufacturing method for electronic component embedded PCB
失效
电子元件嵌入式PCB的PCB板和制造方法
- Patent Title: PCB strip and manufacturing method for electronic component embedded PCB
- Patent Title (中): 电子元件嵌入式PCB的PCB板和制造方法
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Application No.: US12821651Application Date: 2010-06-23
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Publication No.: US08482890B2Publication Date: 2013-07-09
- Inventor: Moon-il Kim , Yul-Kyo Chung , Hwa-Sun Park
- Applicant: Moon-il Kim , Yul-Kyo Chung , Hwa-Sun Park
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0004876 20100119
- Main IPC: H02H3/22
- IPC: H02H3/22
Abstract:
A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.
Public/Granted literature
- US20110176246A1 PCB STRIP AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT EMBEDDED PCB Public/Granted day:2011-07-21
Information query
