Invention Grant
- Patent Title: Electronic component including protruding mounting surface regions and method for manufacturing the same
- Patent Title (中): 包括突出安装表面区域的电子部件及其制造方法
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Application No.: US13072932Application Date: 2011-03-28
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Publication No.: US08482899B2Publication Date: 2013-07-09
- Inventor: Yoji Yamamoto , Shunsuke Takeuchi , Akihiro Motoki , Makoto Ogawa , Masahito Saruban
- Applicant: Yoji Yamamoto , Shunsuke Takeuchi , Akihiro Motoki , Makoto Ogawa , Masahito Saruban
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-075396 20100329; JP2011-037953 20110224
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/228
Abstract:
A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.
Public/Granted literature
- US20110235234A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-09-29
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