Invention Grant
- Patent Title: Heat sink clip with wire clip
- Patent Title (中): 散热片夹线夹
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Application No.: US13207466Application Date: 2011-08-11
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Publication No.: US08482923B2Publication Date: 2013-07-09
- Inventor: Liang Tan , Xiao-Feng Ma
- Applicant: Liang Tan , Xiao-Feng Ma
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110181513 20110630
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Provided is a heat sink clip for fastening a heat sink on a printed circuit board (PCB). The heat sink clip includes two hooks and a wire clip. The two hooks are inversely fixed to the PCB at two opposite sides of the heat sink. The wire clip includes a pressing wire pressing the heat sink, two pairs of deforming wires extending from the lateral of the pressing wire along two radial directions of the pressing wire and away from the PCB, and two engaging wires engaging with the respective hooks such that the deforming wires are bent towards the PCB.
Public/Granted literature
- US20130003302A1 HEAT SINK CLIP WITH WIRE CLIP Public/Granted day:2013-01-03
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