Invention Grant
US08482924B2 Heat spreader facet plane apparatus 有权
散热器小平面装置

  • Patent Title: Heat spreader facet plane apparatus
  • Patent Title (中): 散热器小平面装置
  • Application No.: US12901668
    Application Date: 2010-10-11
  • Publication No.: US08482924B2
    Publication Date: 2013-07-09
  • Inventor: Richard Redpath
  • Applicant: Richard Redpath
  • Agency: Sinorica, LLC
  • Agent Ming Chow
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Heat spreader facet plane apparatus
Abstract:
The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink.
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