Invention Grant
- Patent Title: Heat spreader facet plane apparatus
- Patent Title (中): 散热器小平面装置
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Application No.: US12901668Application Date: 2010-10-11
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Publication No.: US08482924B2Publication Date: 2013-07-09
- Inventor: Richard Redpath
- Applicant: Richard Redpath
- Agency: Sinorica, LLC
- Agent Ming Chow
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink.
Public/Granted literature
- US20120085525A1 HEAT SPREADER FACET PLANE APPARATUS Public/Granted day:2012-04-12
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