Invention Grant
US08482926B2 Optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
有权
光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置
- Patent Title: Optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
- Patent Title (中): 光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置
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Application No.: US12565828Application Date: 2009-09-24
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Publication No.: US08482926B2Publication Date: 2013-07-09
- Inventor: Yuji Yano , Hiroshi Yokota , Shigeru Yasukawa , Masahiro Hasegawa , Aiji Suetake
- Applicant: Yuji Yano , Hiroshi Yokota , Shigeru Yasukawa , Masahiro Hasegawa , Aiji Suetake
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Edwards Wildman Palmer LLP
- Agent David G. Conlin; Steven M. Jensen
- Priority: JP2008-249246 20080926; JP2009-199060 20090828
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
An optical element module according to the present invention includes a plurality of optical elements laminated therein, each optical element including: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein an adhesive is positioned on a further outer circumference side of the spacer section, and the upper optical element and the lower optical element are adhered to each other such that an inside and an outside of the adhesive are ventable through a ventilating section of the adhesive.
Public/Granted literature
Information query
