Invention Grant
- Patent Title: Systems for circuit board heat transfer and method of assembling same
- Patent Title (中): 电路板传热系统及其组装方法
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Application No.: US13109253Application Date: 2011-05-17
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Publication No.: US08482929B2Publication Date: 2013-07-09
- Inventor: David S. Slaton , David McDonald , Jerry L. Wright
- Applicant: David S. Slaton , David McDonald , Jerry L. Wright
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Global Patent Operation
- Agent Mark A. Conklin
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.
Public/Granted literature
- US20120293963A1 SYSTEMS FOR CIRCUIT BOARD HEAT TRANSFER AND METHOD OF ASSEMBLING SAME Public/Granted day:2012-11-22
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