Invention Grant
US08482932B2 Motherboard assembly having serial advanced technology attachment dual in-line memory module
失效
主板组件具有串行高级技术附件双列直插式内存模块
- Patent Title: Motherboard assembly having serial advanced technology attachment dual in-line memory module
- Patent Title (中): 主板组件具有串行高级技术附件双列直插式内存模块
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Application No.: US13207680Application Date: 2011-08-11
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Publication No.: US08482932B2Publication Date: 2013-07-09
- Inventor: Bo Tian , Guo-Yi Chen
- Applicant: Bo Tian , Guo-Yi Chen
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110206543 20110722
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A motherboard assembly includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a memory slot, and an interface. An edge connector is set on a bottom edge of the circuit board. A SATA connector is arranged on the circuit board, and connected to a control chip and the interface, enabling a motherboard communication with the SATA DIMM module.
Public/Granted literature
- US20130038997A1 MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE Public/Granted day:2013-02-14
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