Invention Grant
- Patent Title: Magnetic element utilizing protective sidewall passivation
- Patent Title (中): 使用保护性侧壁钝化的磁性元件
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Application No.: US12236943Application Date: 2008-09-24
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Publication No.: US08482966B2Publication Date: 2013-07-09
- Inventor: Seung H. Kang , Sei Seung Yoon
- Applicant: Seung H. Kang , Sei Seung Yoon
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo
- Main IPC: G11C11/15
- IPC: G11C11/15 ; G11C11/155 ; H01L29/82 ; H01L21/00

Abstract:
Exemplary embodiments of the invention are directed to magnetic elements including a passivation layer for isolation from other on-chip elements. One embodiment is directed to an apparatus comprising a magnetic tunnel junction (MTJ) element. The MTJ element comprises: a first ferromagnetic layer; a second ferromagnetic layer; an insulating layer disposed between the first and second ferromagnetic layers; and an MTJ passivation layer forming protective sidewalls disposed adjacent to the first ferromagnetic layer, the second ferromagnetic layer, and the insulating layer.
Public/Granted literature
- US20100072566A1 Magnetic Element Utilizing Protective Sidewall Passivation Public/Granted day:2010-03-25
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