Invention Grant
- Patent Title: Method of manufacturing non-volatile memory module
- Patent Title (中): 制造非易失性存储器模块的方法
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Application No.: US13366329Application Date: 2012-02-05
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Publication No.: US08482997B2Publication Date: 2013-07-09
- Inventor: Satoru Hanzawa , Hitoshi Kume , Motoyasu Terao , Tomonori Sekiguchi , Makoto Saen
- Applicant: Satoru Hanzawa , Hitoshi Kume , Motoyasu Terao , Tomonori Sekiguchi , Makoto Saen
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2008-110839 20080422
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C11/00 ; H01L21/00

Abstract:
A highly reliable large capacity phase change memory module is realized. A semiconductor device according to the present invention includes a memory array having a structure in which a storage layer using a chalcogenide material and a memory cell constituted of a diode are stacked, and an initialization condition and a rewriting condition are changed in accordance with the layer where a selected memory cell is located. A current mirror circuit is selected in accordance with an operation, and at the same time, the initialization condition and the rewriting condition (here, reset condition) are changed in accordance with the operation by a control mechanism of the reset current in a voltage selection circuit and a current mirror circuit.
Public/Granted literature
- US20120135548A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-05-31
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