Invention Grant
US08482999B2 Semiconductor memory integrated device having a precharge circuit with thin-film transistors gated by a voltage higher than a power supply voltage
有权
半导体存储器集成器件具有通过高于电源电压的电压而门控的薄膜晶体管的预充电电路
- Patent Title: Semiconductor memory integrated device having a precharge circuit with thin-film transistors gated by a voltage higher than a power supply voltage
- Patent Title (中): 半导体存储器集成器件具有通过高于电源电压的电压而门控的薄膜晶体管的预充电电路
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Application No.: US13600412Application Date: 2012-08-31
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Publication No.: US08482999B2Publication Date: 2013-07-09
- Inventor: Hiroyuki Takahashi , Tetsuo Fukushi
- Applicant: Hiroyuki Takahashi , Tetsuo Fukushi
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2009-117889 20090514
- Main IPC: G11C7/12
- IPC: G11C7/12

Abstract:
Provided is a semiconductor integrated device including a semiconductor memory circuit and a peripheral circuit of the semiconductor memory circuit. The peripheral circuit includes a first transistor having a first voltage as a breakdown voltage of a gate oxide film. The semiconductor memory circuit includes a pair of bit lines, one of the pair of bit lines being connected to a gate transistor of a memory cell, and a precharge circuit that includes a transistor having a breakdown voltage substantially equal to that of the first transistor, and precharges the pair of bit lines to a predetermined voltage in response to an activation signal. The activation signal of the precharge circuit is a second voltage higher than the first voltage.
Public/Granted literature
- US20120327732A1 SEMICONDUCTOR INTEGRATED DEVICE Public/Granted day:2012-12-27
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