Invention Grant
- Patent Title: Micromachined ultrasonic transducers
- Patent Title (中): 微加工超声换能器
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Application No.: US12327806Application Date: 2008-12-03
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Publication No.: US08483014B2Publication Date: 2013-07-09
- Inventor: Yongli Huang
- Applicant: Yongli Huang
- Applicant Address: US CA San Jose
- Assignee: Kolo Technologies, Inc.
- Current Assignee: Kolo Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lee & Hayes, PLLC
- Main IPC: H04R19/00
- IPC: H04R19/00

Abstract:
A capacitive micromachined ultrasonic transducer (CMUT) includes a structured membrane which possesses improved frequency response characteristics. Some embodiments provide CMUTs which include a substrate, a first electrode, a second movable electrode, and a structured membrane. The movable second electrode is spaced apart from the first electrode and is coupled to the structured membrane. The structured membrane is shaped to possess a selected resonant frequency or an optimized frequency response. The structured membrane can include a plate and a beam coupled to the plate such that the resonant frequency of the structured membrane is greater than the resonant frequency of the plate. Furthermore, the ratio of the resonant frequency of the structured membrane over the mass of the structured membrane can be greater than the ratio of the resonant frequency of the plate over the mass of the plate. In some embodiments, the CMUT is an embedded spring ESCMUT.
Public/Granted literature
- US20090140609A1 Micromachined Ultrasonic Transducers Public/Granted day:2009-06-04
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