Invention Grant
US08483070B2 Millimeter wave probing of components via a probe device and methods for use therewith
失效
通过探针装置的组件的毫米波探测及其使用方法
- Patent Title: Millimeter wave probing of components via a probe device and methods for use therewith
- Patent Title (中): 通过探针装置的组件的毫米波探测及其使用方法
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Application No.: US13444811Application Date: 2012-04-11
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Publication No.: US08483070B2Publication Date: 2013-07-09
- Inventor: Ahmadreza (Reza) Rofougaran
- Applicant: Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: H04B7/00
- IPC: H04B7/00
Abstract:
Probe data is directly communicating between a probe device and a component of an external device via a wireless millimeter wave communication path. A probe application is executed in accordance with the probe data, for diagnostics and testing, to update component software, and to upload other files and applications to the component.
Public/Granted literature
- US20120196542A1 MILLIMETER WAVE PROBING OF COMPONENTS VIA A PROBE DEVICE AND METHODS FOR USE THEREWITH Public/Granted day:2012-08-02
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