Invention Grant
- Patent Title: High-frequency circuit module
- Patent Title (中): 高频电路模块
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Application No.: US13589578Application Date: 2012-08-20
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Publication No.: US08483104B1Publication Date: 2013-07-09
- Inventor: Tetsuo Saji , Hiroshi Nakamura
- Applicant: Tetsuo Saji , Hiroshi Nakamura
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-180527 20120816
- Main IPC: H04B1/56
- IPC: H04B1/56 ; H04B7/005 ; H04B1/44

Abstract:
Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer 110 for a first frequency band is mounted on a circuit substrate 200, and a second transmission filter 122 and a second reception filter 124 that constitute a second duplexer 120 for a second frequency band are embedded in the circuit substrate 200. The second transmission filter 122 and the second reception filter 124 are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer 110 in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
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