Invention Grant
- Patent Title: Laser diode element assembly and method of driving the same
- Patent Title (中): 激光二极管元件组装及其驱动方法
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Application No.: US13417998Application Date: 2012-03-12
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Publication No.: US08483256B2Publication Date: 2013-07-09
- Inventor: Tomoyuki Oki , Masaru Kuramoto , Rintaro Koda , Hideki Watanabe , Hiroyuki Yokoyama
- Applicant: Tomoyuki Oki , Masaru Kuramoto , Rintaro Koda , Hideki Watanabe , Hiroyuki Yokoyama
- Applicant Address: JP Tokyo JP Miyagi
- Assignee: Sony Corporation,Tohoku University
- Current Assignee: Sony Corporation,Tohoku University
- Current Assignee Address: JP Tokyo JP Miyagi
- Agency: K&L Gates LLP
- Priority: JP2011-058899 20110317
- Main IPC: H01S3/08
- IPC: H01S3/08

Abstract:
A laser diode element assembly includes: a laser diode element; and a light reflector, in which the laser diode element includes (a) a laminate structure body configured by laminating, in order, a first compound semiconductor layer of a first conductivity type made of a GaN-based compound semiconductor, a third compound semiconductor layer made of a GaN-based compound semiconductor and including a light emission region, and a second compound semiconductor layer of a second conductivity type made of a GaN-based compound semiconductor, the second conductivity type being different from the first conductivity type, (b) a second electrode formed on the second compound semiconductor layer, and (c) a first electrode electrically connected to the first compound semiconductor layer, the laminate structure body includes a ridge stripe structure, and a minimum width Wmin and a maximum width Wmax of the ridge stripe structure satisfy 1
Public/Granted literature
- US20120236886A1 LASER DIODE ELEMENT ASSEMBLY AND METHOD OF DRIVING THE SAME Public/Granted day:2012-09-20
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