Invention Grant
- Patent Title: Acoustic path for a wireless communications device
- Patent Title (中): 无线通信设备的声学路径
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Application No.: US11191108Application Date: 2005-07-27
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Publication No.: US08483776B2Publication Date: 2013-07-09
- Inventor: Matthew Justin Murray
- Applicant: Matthew Justin Murray
- Applicant Address: JP Tokyo SE Lund
- Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee Address: JP Tokyo SE Lund
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04M1/00 ; H04M9/00 ; H05K5/00 ; H01Q1/24 ; H04R25/00 ; H04R9/08 ; H04R11/04 ; H04R17/02 ; H04R19/04 ; H04R21/02 ; H01R3/00
Abstract:
A printed circuit board for a wireless communications device includes an acoustic path, and acoustically couples microphone circuitry mounted to a surface of the printed circuit board to an exterior of the wireless communications device. A portion of the acoustic path is integrally formed with the printed circuit board and extends generally parallel to the surface of the printed circuit board. One end of the acoustic path is disposed proximate the microphone circuitry and an opposing end opens to receive acoustic sound from the exterior of the wireless communications device. Audible sound propagates through the acoustic path to the microphone circuitry.
Public/Granted literature
- US20070026905A1 Acoustic path for a wireless communications device Public/Granted day:2007-02-01
Information query
