Invention Grant
- Patent Title: Heating element temperature estimation apparatus
- Patent Title (中): 加热元件温度估算装置
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Application No.: US12972960Application Date: 2010-12-20
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Publication No.: US08483989B2Publication Date: 2013-07-09
- Inventor: Takayuki Enomoto
- Applicant: Takayuki Enomoto
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Arent Fox LLP
- Priority: JP2010-003903 20100112
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K3/00 ; G01K3/08 ; G01B5/00

Abstract:
In an apparatus for estimating a temperature of a heating element such as IGBT mounted on an electronic printed circuit board, a first temperature and a second temperature at positions away from the heating element are detected, and it is determined whether a cooling device is operative. The temperature of the heating element is estimated based on the first and second temperatures using a first equation when the cooling device is inoperative, whereas it is estimated using a second equation when the cooling device is operative, thereby enabling to accurately estimate the temperature of the heating element equipped with the cooling device.
Public/Granted literature
- US20110172947A1 HEATING ELEMENT TEMPERATURE ESTIMATION APPARATUS Public/Granted day:2011-07-14
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