Invention Grant
- Patent Title: Method of producing printed circuit board incorporating resistance element
- Patent Title (中): 制造电阻元件的印刷电路板的制造方法
-
Application No.: US12791701Application Date: 2010-06-01
-
Publication No.: US08484832B2Publication Date: 2013-07-16
- Inventor: Garo Miyamoto
- Applicant: Garo Miyamoto
- Applicant Address: JP Tokyo-To
- Assignee: Nippon Mektron, Ltd.
- Current Assignee: Nippon Mektron, Ltd.
- Current Assignee Address: JP Tokyo-To
- Agency: Jacobson Holman PLLC
- Priority: JP2006-312959 20061120
- Main IPC: H01C17/00
- IPC: H01C17/00

Abstract:
There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.
Public/Granted literature
- US20100236065A1 Method of Producing Printed Circuit Board Incorporating Resistance Element Public/Granted day:2010-09-23
Information query