Invention Grant
US08484832B2 Method of producing printed circuit board incorporating resistance element 有权
制造电阻元件的印刷电路板的制造方法

  • Patent Title: Method of producing printed circuit board incorporating resistance element
  • Patent Title (中): 制造电阻元件的印刷电路板的制造方法
  • Application No.: US12791701
    Application Date: 2010-06-01
  • Publication No.: US08484832B2
    Publication Date: 2013-07-16
  • Inventor: Garo Miyamoto
  • Applicant: Garo Miyamoto
  • Applicant Address: JP Tokyo-To
  • Assignee: Nippon Mektron, Ltd.
  • Current Assignee: Nippon Mektron, Ltd.
  • Current Assignee Address: JP Tokyo-To
  • Agency: Jacobson Holman PLLC
  • Priority: JP2006-312959 20061120
  • Main IPC: H01C17/00
  • IPC: H01C17/00
Method of producing printed circuit board incorporating resistance element
Abstract:
There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.
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