Invention Grant
- Patent Title: Method of manufacturing a heat conducting structure having a coplanar heated portion
- Patent Title (中): 制造具有共面加热部分的导热结构的方法
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Application No.: US12562352Application Date: 2009-09-18
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Publication No.: US08484845B2Publication Date: 2013-07-16
- Inventor: Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
- Applicant: Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
- Applicant Address: TW New Taipei TW New Taipei
- Assignee: CPUMate Inc.,Golden Sun News Techniques Co., Ltd.
- Current Assignee: CPUMate Inc.,Golden Sun News Techniques Co., Ltd.
- Current Assignee Address: TW New Taipei TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: B21D53/06
- IPC: B21D53/06 ; B21D22/06

Abstract:
A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.
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