Invention Grant
US08484889B2 Seed sticker 有权
种子贴纸

  • Patent Title: Seed sticker
  • Patent Title (中): 种子贴纸
  • Application No.: US13259922
    Application Date: 2009-09-29
  • Publication No.: US08484889B2
    Publication Date: 2013-07-16
  • Inventor: Tae Ha WooJung Min Seo
  • Applicant: Tae Ha WooJung Min Seo
  • Applicant Address: KR Daejeon
  • Assignee: OMICSIS, Inc.
  • Current Assignee: OMICSIS, Inc.
  • Current Assignee Address: KR Daejeon
  • Priority: KR10-2009-0025189 20090325
  • International Application: PCT/KR2009/005548 WO 20090929
  • International Announcement: WO2010/110512 WO 20100930
  • Main IPC: A01C1/04
  • IPC: A01C1/04 A01C1/00
Seed sticker
Abstract:
The present invention relates to a seed sticker for seeding and planting flowers or sprouts easily and quickly in a small vessel or in a flower garden and a manufacturing method thereof. The present invention is characterized by a seed sticker, inside of which a seed is enshrined, comprising: a transfer paper wherein a coating layer is formed on the surface of the transfer paper; an adhesive layer which is formed on the surface of the coating layer; a seed pellet which is enshrined on the surface of the adhesive layer; a red clay soil sheet accumulated over the upper part of the seed pellet; and a polyvinyl alcohol (PVA) sheet accumulated over the upper part of the red clay soil sheet and covering both the seed pellet and the red clay soil sheet, and the edge of which is bonded to the adhesive layer.
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