Invention Grant
- Patent Title: Thermal loop flow sensor
- Patent Title (中): 热回路流量传感器
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Application No.: US12863294Application Date: 2009-01-13
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Publication No.: US08485030B2Publication Date: 2013-07-16
- Inventor: Jose Luis de Corral
- Applicant: Jose Luis de Corral
- Applicant Address: US MA Milford
- Assignee: Waters Technologies Corporation
- Current Assignee: Waters Technologies Corporation
- Current Assignee Address: US MA Milford
- Agency: Waters Technologies Corporation
- International Application: PCT/US2009/030791 WO 20090113
- International Announcement: WO2009/091703 WO 20090723
- Main IPC: G01F1/68
- IPC: G01F1/68

Abstract:
A flow sensor includes a fluidic component, such as a tube, a heat source, an upstream temperature sensor, and a downstream temperature sensors. The fluidic component defines a flow path having inlet and outlet ends disposed closer to each other than to a mid-point of the flow path. The heat source and the upstream and downstream temperature sensors are disposed in thermal communication with a fluid in the flow path.
Public/Granted literature
- US20110100114A1 Thermal Loop Flow Sensor Public/Granted day:2011-05-05
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