Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US13171875Application Date: 2011-06-29
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Publication No.: US08485693B2Publication Date: 2013-07-16
- Inventor: Keng-Yi Lee
- Applicant: Keng-Yi Lee
- Applicant Address: TW Hsin-Chu
- Assignee: AU Optronics Corporation
- Current Assignee: AU Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW99147346A 20101231
- Main IPC: F21L19/00
- IPC: F21L19/00 ; F21V3/00 ; G09F13/04 ; G09F13/08

Abstract:
A backlight module includes a chassis, a printed circuit board, a light source, and a light guide plate. The chassis includes a bottom plate and a sidewall. The sidewall is disposed on at least one side of the bottom plate. The sidewall has a recess therein. At least one part of the printed circuit board is located in the recess. The light source is electrically connected to the printed circuit board. The light incident side of the light guide plate is opposite to the light emitting side of the light source.
Public/Granted literature
- US20120170312A1 BACKLIGHT MODULE Public/Granted day:2012-07-05
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