Invention Grant
- Patent Title: Fine structure formation apparatus
- Patent Title (中): 精细结构形成装置
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Application No.: US12824957Application Date: 2010-06-28
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Publication No.: US08485811B2Publication Date: 2013-07-16
- Inventor: Daisuke Shimao , Takanori Yamasaki , Mitsuru Hasegawa
- Applicant: Daisuke Shimao , Takanori Yamasaki , Mitsuru Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Industrial Equipment Systems Co., Ltd.
- Current Assignee: Hitachi Industrial Equipment Systems Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-255685 20091109
- Main IPC: B29C59/04
- IPC: B29C59/04

Abstract:
A fine structure formation apparatus includes a preheating heater to heat up the surface of belt-like mold alone, right before contacting the belt-like mold to heating and pressurizing rollers, the temperature of the surface of the belt-like mold is made equal to that of the heating and pressurizing rollers, enabling to reliably obtain a predetermined temperature, and cooling rollers or a cooling blower are arranged right after the heating and pressurizing rollers, enabling cooling by a forced cooling and pressure holding, and to transfer a pattern.
Public/Granted literature
- US20110109011A1 FINE STRUCTURE FORMATION APPARATUS Public/Granted day:2011-05-12
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