Invention Grant
- Patent Title: Polishing pad for endpoint detection and related methods
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Application No.: US10444921Application Date: 2003-05-23
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Publication No.: US08485862B2Publication Date: 2013-07-16
- Inventor: Boguslaw A. Swedek , Manoocher Birang
- Applicant: Boguslaw A. Swedek , Manoocher Birang
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24D11/00
Abstract:
A polishing pad has a polishing layer with a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
Public/Granted literature
- US20030236055A1 Polishing pad for endpoint detection and related methods Public/Granted day:2003-12-25
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