Invention Grant
- Patent Title: Process for the production of packaging material for electronic component cases
- Patent Title (中): 电子元件包装材料生产工艺
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Application No.: US13495100Application Date: 2012-06-13
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Publication No.: US08486217B2Publication Date: 2013-07-16
- Inventor: Hiroshi Hata
- Applicant: Hiroshi Hata
- Applicant Address: JP Isehara-shi
- Assignee: Showa Denko Packaging Co.
- Current Assignee: Showa Denko Packaging Co.
- Current Assignee Address: JP Isehara-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-133817 20050502
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00

Abstract:
A method of producing a packaging material including a temporary bonding which temporarily bonds a first sheet including a thermoplastic resin non-oriented film layer and a thermoplastic adhesive resin layer laminated on one surface of the thermoplastic resin non-oriented film layer and a second sheet including a heat resistant resin oriented film layer and an aluminum foil layer laminated on one surface of the heat resistant resin oriented film layer by passing the first and second sheets between a pair of rolls in a state in which the thermoplastic adhesive resin layer and the aluminum foil layer are brought into contact with each other to press them while heating in a state in which the thermoplastic adhesive resin does not melt to obtain a pre-laminated sheet, and a complete bonding which integrally bonds the first and second sheets by heating the pre-laminated sheet to melt the thermoplastic adhesive resin.
Public/Granted literature
- US20120273128A1 PROCESS AND EQUIPMENT FOR THE PRODUCTION OF PACKAGING MATERIAL FOR ELECTRONIC COMPONENT CASES Public/Granted day:2012-11-01
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