Invention Grant
US08486752B2 Phase change memory device having dielectric layer for isolating contact structure formed by growth, semiconductor device having the same, and methods for manufacturing the devices 有权
具有用于隔离由生长形成的接触结构的绝缘层的相变存储器件,具有该接触结构的半导体器件及其制造方法

  • Patent Title: Phase change memory device having dielectric layer for isolating contact structure formed by growth, semiconductor device having the same, and methods for manufacturing the devices
  • Patent Title (中): 具有用于隔离由生长形成的接触结构的绝缘层的相变存储器件,具有该接触结构的半导体器件及其制造方法
  • Application No.: US12949275
    Application Date: 2010-11-18
  • Publication No.: US08486752B2
    Publication Date: 2013-07-16
  • Inventor: Heon Yong Chang
  • Applicant: Heon Yong Chang
  • Applicant Address: KR Kyoungki-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Kyoungki-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2008-0099559 20081010
  • Main IPC: H01L21/06
  • IPC: H01L21/06
Phase change memory device having dielectric layer for isolating contact structure formed by growth, semiconductor device having the same, and methods for manufacturing the devices
Abstract:
A phase change memory device includes a semiconductor substrate having an impurity region and an interlayer dielectric applying a tensile stress formed on the semiconductor substrate and having contact holes exposing the impurity region. Switching elements are formed in the contact holes; and sidewall spacers interposed between the switching elements and the interlayer dielectric and formed as a dielectric layer applying a compressive stress.
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