Invention Grant
- Patent Title: Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
- Patent Title (中): 用于热接触半导体部件布置的相对电连接的方法
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Application No.: US13395121Application Date: 2010-09-08
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Publication No.: US08486766B2Publication Date: 2013-07-16
- Inventor: Matthias Schroeder , Dominic Schroeder , Petra Hennig
- Applicant: Matthias Schroeder , Dominic Schroeder , Petra Hennig
- Applicant Address: DE Jena
- Assignee: JENOPTIK Laser GmbH
- Current Assignee: JENOPTIK Laser GmbH
- Current Assignee Address: DE Jena
- Agency: Skaar Ulbrich Macari, P.A.
- Priority: DE102009040835 20090909
- International Application: PCT/EP2010/063174 WO 20100908
- International Announcement: WO2011/029846 WO 20110317
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.
Public/Granted literature
- US20120252144A1 METHOD FOR THERMALLY CONTACTING OPPOSING ELECTRICAL CONNECTIONS OF A SEMICONDUCTOR COMPONENT ARRANGEMENT Public/Granted day:2012-10-04
Information query
IPC分类:
