Invention Grant
- Patent Title: Method of forming CMOS FinFET device
- Patent Title (中): CMOS FinFET器件的形成方法
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Application No.: US13340937Application Date: 2011-12-30
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Publication No.: US08486770B1Publication Date: 2013-07-16
- Inventor: Cheng-Hsien Wu , Chih-Hsin Ko , Clement Hsingjen Wann
- Applicant: Cheng-Hsien Wu , Chih-Hsin Ko , Clement Hsingjen Wann
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/335
- IPC: H01L21/335

Abstract:
A CMOS FinFET device and method for fabricating a CMOS FinFET device is disclosed. An exemplary CMOS FinFET device includes a substrate including a first region and a second region. The CMOS FinFET further includes a fin structure disposed over the substrate including a first fin in the first region and a second fin in the second region. The CMOS FinFET further includes a first portion of the first fin comprising a material that is the same material as the substrate and a second portion of the first fin comprising a III-V semiconductor material deposited over the first portion of the first fin. The CMOS FinFET further includes a first portion of the second fin comprising a material that is the same material as the substrate and a second portion of the second fin comprising a germanium (Ge) material deposited over the first portion of the second fin.
Public/Granted literature
- US20130168771A1 Method of Forming CMOS FinFET Device Public/Granted day:2013-07-04
Information query
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