Invention Grant
- Patent Title: Method for manufacturing microcrystalline semiconductor and thin film transistor
- Patent Title (中): 微晶半导体和薄膜晶体管的制造方法
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Application No.: US13343734Application Date: 2012-01-05
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Publication No.: US08486777B2Publication Date: 2013-07-16
- Inventor: Mitsuhiro Ichijo , Kazutaka Kuriki , Tomokazu Yokoi , Toshiya Endo
- Applicant: Mitsuhiro Ichijo , Kazutaka Kuriki , Tomokazu Yokoi , Toshiya Endo
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-244375 20091023
- Main IPC: H01L21/205
- IPC: H01L21/205

Abstract:
A technique for manufacturing a microcrystalline semiconductor layer with high mass productivity is provided. In a reaction chamber of a plasma CVD apparatus, an upper electrode and a lower electrode are provided in almost parallel to each other. A hollow portion is formed in the upper electrode, and the upper electrode includes a shower plate having a plurality of holes formed on a surface of the upper electrode which faces the lower electrode. A substrate is provided over the lower electrode. A gas containing a deposition gas and hydrogen is supplied to the reaction chamber from the shower plate through the hollow portion of the upper electrode, and a rare gas is supplied to the reaction chamber from a portion different from the upper electrode. Accordingly, high-frequency power is supplied to the upper electrode to generate plasma, so that a microcrystalline semiconductor layer is formed over the substrate.
Public/Granted literature
- US20120100677A1 METHOD FOR MANUFACTURING MICROCRYSTALLINE SEMICONDUCTOR AND THIN FILM TRANSISTOR Public/Granted day:2012-04-26
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