Invention Grant
- Patent Title: Bipolar junction transistor with epitaxial contacts
- Patent Title (中): 具有外延触点的双极结晶体管
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Application No.: US13481048Application Date: 2012-05-25
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Publication No.: US08486797B1Publication Date: 2013-07-16
- Inventor: Bahman Hekmatshoartabari , Tak H. Ning , Devendra K. Sadana , Ghavam G. Shahidi , Davood Shahrjerdi
- Applicant: Bahman Hekmatshoartabari , Tak H. Ning , Devendra K. Sadana , Ghavam G. Shahidi , Davood Shahrjerdi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
Bipolar junction transistors are provided in which at least one of an emitter contact, a base contact, or a collector contact thereof is formed by epitaxially growing a doped SixGe1-x layer, wherein x is 0≦x≦1, at a temperature of less than 500° C. The doped SixGe1-x layer comprises crystalline portions located on exposed surfaces of a crystalline semiconductor substrate and non-crystalline portions that are located on exposed surfaces of a passivation layer which can be formed and patterned on the crystalline semiconductor substrate. The doped SixGe1-x layer of the present disclosure, including the non-crystalline and crystalline portions, contains from 5 atomic percent to 40 atomic percent hydrogen.
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