Invention Grant
US08487056B2 Positive resist composition and method of forming resist pattern
有权
正型抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Positive resist composition and method of forming resist pattern
- Patent Title (中): 正型抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US13539558Application Date: 2012-07-02
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Publication No.: US08487056B2Publication Date: 2013-07-16
- Inventor: Tasuku Matsumiya , Daiju Shiono , Tomoyuki Hirano , Takahiro Dazai , Kotaro Endo
- Applicant: Tasuku Matsumiya , Daiju Shiono , Tomoyuki Hirano , Takahiro Dazai , Kotaro Endo
- Applicant Address: JP Kanagawa-Ken
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2008-309850 20081204; JPP2009-130554 20090529
- Main IPC: C08F28/06
- IPC: C08F28/06
Abstract:
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1), a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group, and a structural unit (a3) derived from an acrylate ester containing a hydroxy group-containing aliphatic hydrocarbon group represented by general formula (a3-1), and the amount of the structural unit (a3) based on the combined total of all structural units constituting the polymeric compound (A1) being in the range of 1 to 30 mol %.
Public/Granted literature
- US20120329969A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2012-12-27
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