Invention Grant
- Patent Title: Wired circuit board assembly sheet
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Application No.: US12929902Application Date: 2011-02-23
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Publication No.: US08487189B2Publication Date: 2013-07-16
- Inventor: Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
- Applicant: Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2006-111163 20060413
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
Public/Granted literature
- US20110155421A1 Wired circuit board assembly sheet Public/Granted day:2011-06-30
Information query
