Invention Grant
- Patent Title: Flexible printed circuit board
- Patent Title (中): 柔性印刷电路板
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Application No.: US12755390Application Date: 2010-04-06
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Publication No.: US08487190B2Publication Date: 2013-07-16
- Inventor: Yao-an Mo
- Applicant: Yao-an Mo
- Applicant Address: TW Hsin-Chu
- Assignee: Au Optronics Corp.
- Current Assignee: Au Optronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Priority: TW98111547A 20090407; TW98137853A 20091106
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K1/16 ; G02F1/1345

Abstract:
A flexible printed circuit board includes a substrate, signal lines, a first reinforcing layer, and a second reinforcing layer. The first surface of the substrate includes a layout zone and a reinforcing zone disposed nearby the layout zone. The signal lines are disposed on the layout zone. The first reinforcing layer is disposed on the reinforcing zone. The second reinforcing layer is disposed on the second surface of the substrate.
Public/Granted literature
- US20100252307A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2010-10-07
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