Invention Grant
- Patent Title: Conductive plate
- Patent Title (中): 导电板
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Application No.: US12826710Application Date: 2010-06-30
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Publication No.: US08487193B2Publication Date: 2013-07-16
- Inventor: Chih-Chieh Chang , Jeah-Sheng Wu , Chih-Han Chao
- Applicant: Chih-Chieh Chang , Jeah-Sheng Wu , Chih-Han Chao
- Applicant Address: TW Chu-Nan, Miao-Li County
- Assignee: Chimei Innolux Corporation
- Current Assignee: Chimei Innolux Corporation
- Current Assignee Address: TW Chu-Nan, Miao-Li County
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H05K1/09
- IPC: H05K1/09
Abstract:
A conductive plate includes a substrate, an adhesive, and a conductive layer attached to the substrate through the adhesive. The conductive layer includes a plurality of conductive films, each of which includes a plurality of nanounits.
Public/Granted literature
- US20110024166A1 CONDUCTIVE PLATE Public/Granted day:2011-02-03
Information query
