Invention Grant
US08487291B2 Programmable metallization memory cell with layered solid electrolyte structure
有权
具有层状固体电解质结构的可编程金属化存储单元
- Patent Title: Programmable metallization memory cell with layered solid electrolyte structure
- Patent Title (中): 具有层状固体电解质结构的可编程金属化存储单元
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Application No.: US12362640Application Date: 2009-01-30
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Publication No.: US08487291B2Publication Date: 2013-07-16
- Inventor: Nurul Amin , Insik Jin , Wei Tian , Andrew James Wirebaugh , Venugopalan Vaithyanathan , Ming Sun
- Applicant: Nurul Amin , Insik Jin , Wei Tian , Andrew James Wirebaugh , Venugopalan Vaithyanathan , Ming Sun
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Mueting Raasch & Gebhardt PA
- Main IPC: H01L47/00
- IPC: H01L47/00 ; G11C11/00

Abstract:
Programmable metallization memory cells having an active electrode, an opposing inert electrode and a variable resistive element separating the active electrode from the inert electrode. The variable resistive element includes a plurality of alternating solid electrolyte layers and electrically conductive layers. The electrically conductive layers electrically couple the active electrode to the inert electrode in a programmable metallization memory cell. Methods to form the same are also disclosed.
Public/Granted literature
- US20100193761A1 PROGRAMMABLE METALLIZATION MEMORY CELL WITH LAYERED SOLID ELECTROLYTE STRUCTURE Public/Granted day:2010-08-05
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