Invention Grant
- Patent Title: High performance compliant wafer test probe
- Patent Title (中): 高性能兼容晶圆测试探头
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Application No.: US12771697Application Date: 2010-04-30
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Publication No.: US08487304B2Publication Date: 2013-07-16
- Inventor: S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
- Applicant: S. Jay Chey , Dustin M. Fregeau , Donna S. Zupanski-Nielsen , Aparna Prabhakar , Pavan Samudrala , Mohammed S. Shaikh
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Rayn, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/48 ; H01L23/52

Abstract:
An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.
Public/Granted literature
- US20110266539A1 High Performance Compliant Wafer Test Probe Public/Granted day:2011-11-03
Information query
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