Invention Grant
US08487316B2 Method of manufacturing an integrated semiconductor substrate structure with device areas for definition of GaN-based devices and CMOS devices 有权
制造具有用于GaN基器件和CMOS器件的定义的器件区域的集成半导体衬底结构的方法

  • Patent Title: Method of manufacturing an integrated semiconductor substrate structure with device areas for definition of GaN-based devices and CMOS devices
  • Patent Title (中): 制造具有用于GaN基器件和CMOS器件的定义的器件区域的集成半导体衬底结构的方法
  • Application No.: US12914930
    Application Date: 2010-10-28
  • Publication No.: US08487316B2
    Publication Date: 2013-07-16
  • Inventor: Kai ChengStefan Degroote
  • Applicant: Kai ChengStefan Degroote
  • Applicant Address: BE Leuven
  • Assignee: IMEC
  • Current Assignee: IMEC
  • Current Assignee Address: BE Leuven
  • Agency: Knobbe Martens Olson & Bear LLP
  • Priority: EP09174721 20091030
  • Main IPC: H01L29/04
  • IPC: H01L29/04 H01L29/15 H01L31/036
Method of manufacturing an integrated semiconductor substrate structure with device areas for definition of GaN-based devices and CMOS devices
Abstract:
An integrated semiconductor substrate structure is disclosed. In one aspect, the structure includes a substrate, a GaN-heterostructure and a semiconductor substrate layer. The GaN heterostructure is present in a first device area for definition of GaN-based devices, and is covered at least partially with a protection layer. The semiconductor substrate layer is present in a second device area for definition of CMOS devices. At least one of the GaN heterostructure and the semiconductor substrate layer is provided in at least one trench in the substrate, so that the GaN heterostructure and the semiconductor substrate layer are laterally juxtaposed.
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