Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US12887698Application Date: 2010-09-22
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Publication No.: US08487347B2Publication Date: 2013-07-16
- Inventor: Zhenyu Xie , Xiang Liu , Xu Chen
- Applicant: Zhenyu Xie , Xiang Liu , Xu Chen
- Applicant Address: CN Beijing
- Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN200910093194 20090925
- Main IPC: H01L27/118
- IPC: H01L27/118
Abstract:
An array substrate comprises a substrate provided with a circuit pattern and covering layers that cover the upper surfaces and side surfaces of respective portions of the circuit pattern.
Public/Granted literature
- US20110073867A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-03-31
Information query
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