Invention Grant
- Patent Title: Devices and methods for preventing capacitor leakage
- Patent Title (中): 防止电容器泄漏的装置和方法
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Application No.: US12753594Application Date: 2010-04-02
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Publication No.: US08487361B2Publication Date: 2013-07-16
- Inventor: Kuo-Chi Tu
- Applicant: Kuo-Chi Tu
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
Devices and methods for preventing capacitor leakage caused by sharp tip. The formation of sharp tip is avoided by a thicker bottom electrode which fully fills a micro-trench that induces formation of the sharp tip. Alternatively, formation of the sharp tip can be avoided by recessing the contact plug to substantially eliminate the micro-trench.
Public/Granted literature
- US20100187589A1 DEVICES AND METHODS FOR PREVENTING CAPACITOR LEAKAGE Public/Granted day:2010-07-29
Information query
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