Invention Grant
- Patent Title: Power semiconductor device
- Patent Title (中): 功率半导体器件
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Application No.: US13234802Application Date: 2011-09-16
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Publication No.: US08487374B2Publication Date: 2013-07-16
- Inventor: Hiroshi Ohta , Yasuto Sumi , Kiyoshi Kimura , Junji Suzuki , Hiroyuki Irifune , Wataru Saito , Syotaro Ono
- Applicant: Hiroshi Ohta , Yasuto Sumi , Kiyoshi Kimura , Junji Suzuki , Hiroyuki Irifune , Wataru Saito , Syotaro Ono
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2010-216583 20100928
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
In general, according to one embodiment, a power semiconductor device includes a first pillar region, a second pillar region, and an epitaxial layer of a first conductivity type on a first semiconductor layer. The first pillar region is composed of a plurality of first pillar layers of a second conductivity type and a plurality of second pillar layers of the first conductivity type alternately arranged along a first direction. The second pillar region is adjacent to the first pillar region along the first direction and includes a third pillar layer of the second conductivity type, a fourth pillar layer of the first conductivity type, and a fifth pillar layer of the second conductivity type in this order along the first direction. A plurality of second base layers of the second conductivity type electrically connected, respectively, onto the third pillar layer and the fifth pillar layer and spaced from each other.
Public/Granted literature
- US20120074491A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2012-03-29
Information query
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