Invention Grant
- Patent Title: Solid-state image pickup apparatus, method for manufacturing same, and electronic device
- Patent Title (中): 固体摄像装置及其制造方法以及电子装置
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Application No.: US13105196Application Date: 2011-05-11
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Publication No.: US08487388B2Publication Date: 2013-07-16
- Inventor: Kazunobu Ota
- Applicant: Kazunobu Ota
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-116461 20100520; JP2011-070424 20110328
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L29/84 ; H01L31/18
Abstract:
A solid-state image pickup apparatus includes a substrate, a solid-state image pickup device, and a Micro Electro Mechanical Systems (MEMS) device. The solid-state image pickup device and the MEMS device are configured to be formed on the same substrate.
Public/Granted literature
- US20110284976A1 SOLID-STATE IMAGE PICKUP APPARATUS, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE Public/Granted day:2011-11-24
Information query
IPC分类:
