Invention Grant
- Patent Title: LED package
- Patent Title (中): LED封装
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Application No.: US12886124Application Date: 2010-09-20
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Publication No.: US08487418B2Publication Date: 2013-07-16
- Inventor: Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
- Applicant: Hidenori Egoshi , Kazuhiro Tamura , Hiroaki Oshio , Satoshi Shimizu , Teruo Takeuchi , Kazuhiro Inoue , Iwao Matsumoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2010-019781 20100129; JP2010-143663 20100624
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
Public/Granted literature
- US20110186875A1 LED PACKAGE Public/Granted day:2011-08-04
Information query
IPC分类:
