An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.