Invention Grant
- Patent Title: Three-dimensional system-in-package architecture
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Application No.: US12631346Application Date: 2009-12-04
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Publication No.: US08487444B2Publication Date: 2013-07-16
- Inventor: Oscar M. K. Law , Kuo H. Wu
- Applicant: Oscar M. K. Law , Kuo H. Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.
Public/Granted literature
- US20100225002A1 Three-Dimensional System-in-Package Architecture Public/Granted day:2010-09-09
Information query
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