Invention Grant
US08488271B2 Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device
失效
使用导电粘合剂的粘合结构和方法，使用粘合结构和方法的磁盘驱动装置以及用于制造磁盘驱动装置的方法
- Patent Title: Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device
- Patent Title (中): 使用导电粘合剂的粘合结构和方法，使用粘合结构和方法的磁盘驱动装置以及用于制造磁盘驱动装置的方法
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Application No.: US12497848Application Date: 2009-07-06
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Publication No.: US08488271B2Publication Date: 2013-07-16
- Inventor: Tomoyuki Tashiro , Akikazu Shibata
- Applicant: Tomoyuki Tashiro , Akikazu Shibata
- Applicant Address: JP Shizuoka
- Assignee: Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd.
- Current Assignee Address: JP Shizuoka
- Agency: Fulwider Patton LLP
- Main IPC: G11B33/02
- IPC: G11B33/02 ; G11B33/12
Abstract:
A base plate containing aluminum as a main component and an electrically conductive counter plate are bonded together through the medium of an electrically conductive adhesive. Even when an oxide film is formed on the surface of the base plate, electrical continuity between the base plate and the counter plate, which are connected together through the medium of the electrically conductive adhesive, is improved by a process of applying a resistance lowering voltage, which reduces the resistance component due to the oxide film by causing a dielectric breakdown.
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