Invention Grant
- Patent Title: Method and apparatus for providing acknowledgment bundling
- Patent Title (中): 用于提供确认捆绑的方法和装置
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Application No.: US12489988Application Date: 2009-06-23
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Publication No.: US08488533B2Publication Date: 2013-07-16
- Inventor: Xiangguang Che , Peng Chen , Frank Frederiksen , Troels Kolding
- Applicant: Xiangguang Che , Peng Chen , Frank Frederiksen , Troels Kolding
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Ditthavong Mori & Steiner, P.C.
- Main IPC: H04W72/12
- IPC: H04W72/12
Abstract:
An approach is provided for acknowledgement bundling. Dynamically scheduling of one or more of subframes per bundling window is performed by reusing an assignment index field (e.g., downlink assignment index (DAI) field). The assignment index field has a value greater than or equal to number of previously assigned subframes within the bundling window. The bundling window defines a group of subframes for common acknowledgement.
Public/Granted literature
- US20090323617A1 METHOD AND APPARATUS FOR PROVIDING ACKNOWLEDGMENT BUNDLING Public/Granted day:2009-12-31
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